Jungle Leopard 2g nanometer abicah igrisi

I-Silicone lubricant ine-insulation yombane ebalaseleyo, i-thermal conductivity ye-16W/MK, ukunyamezela kobushushu obuphezulu, kunye nokumelana okubalaseleyo kukuhlwa. Iqinisekisa ukusebenza kakuhle kwe-CPU epholileyo ngokunyusa ukuhanjiswa kwe-thermal.

Intlama yeThermal yee-CPU zekhompyuter yinto yokuphelisa ubushushu esetyenziswa kufakelo lwezipholile ze-CPU. Ihlala ibekwe phakathi kwe-CPU chip kunye nesiseko se-heatsink ukuzalisa izithuba zemizuzu, ukuphucula ukusebenza kakuhle kobushushu, kunye nokunciphisa ukuxhathisa ubushushu.

I-CPU ye-thermal paste ibandakanya ikhompawundi yepolymer ene-conductivity ephezulu ye-thermal kunye nokuguquguquka, ngokuyintloko kubandakanya izinto ezifana ne-silicone kunye nee-oxide zetsimbi. Iimpawu zayo eziphambili ziquka:

1. Ukuzaliswa kwe-Gap: Rhoqo, kukho indawo encinci phakathi kwe-CPU chip kunye nesiseko se-heatsink, ekhokelela ekunciphiseni ukusebenza kakuhle kobushushu. I-Thermal intlama igcwalisa le mingxunya mincinci, inciphisa ubukho bomoya kwaye iphucula ukusebenza kakuhle kokugqithiswa kobushushu.

2. Ukuphucula ukuhanjiswa kobushushu: I-Thermal paste iqhayisa nge-thermal conductivity ekhethekileyo, ikhawulezisa ukuhanjiswa kobushushu obuveliswa yi-CPU kwiheatsink kunye nokugcina ubushushu be-CPU obuzinzile.

3. Ukukhusela i-CPU: I-Thermal paste inokunciphisa ingxabano phakathi kwe-CPU kunye ne-heatsink, ithintele ukuguga kunye nokukrazula, kunye nokwandisa ubomi be-CPU kunye ne-heatsink.

Ngexesha lokudityaniswa kwe-CPU epholileyo, ukusetyenziswa kwesixa esifanelekileyo se-CPU ye-thermal paste kunokwandisa ukutshatyalaliswa kobushushu, ukuthintela imiba yokusebenza kunye nomonakalo obangelwa kukushisa kwe-CPU. Ke ngoko, ukukhetha intlama ye-thermal ekumgangatho ophezulu kwaye uyisebenzise ngokuchanekileyo kumphezulu we-CPU kubalulekile ukuqinisekisa ubushushu obuzinzileyo, obuphantsi be-CPU.