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Jungle Leopard 4g nanometer abicah igrisi
ukwazisa
Igrisi yeSilicone inokufakelwa kombane okugqwesileyo, i-thermal conductivity ye-16W/MK, ukumelana nobushushu obuphezulu, kunye nokumelana nokugqwesa okugqwesileyo. Yenza i-CPU isebenze ngokugqibeleleyo idlale i-thermal conductivity.
Igrisi ye-Thermal yekhompyuter yeCPU sisixhobo sokuphelisa ubushushu esisetyenziselwa ukufakela okupholileyo kweCPU. Ihlala isetyenziswa phakathi kwe-CPU chip kunye nesiseko se-heatsink ukuzalisa isithuba esincinci, ukuphucula ukusebenza kakuhle kobushushu, kunye nokunciphisa ukuxhathisa ubushushu.
Igrisi ye-CPU ye-thermal idla ngokuba yi-polymer compound ene-conductivity ephezulu ye-thermal kunye ne-plasticity, ikakhulu yenziwe ngezinto ezifana nejeli ye-silica kunye nee-oxide zetsimbi. Iimpawu zayo eziphambili ziquka:
1. Gcwalisa i-gap encinci: Kukho i-gap encinci phakathi kwe-CPU chip kunye nesiseko se-heat sink, okubangelwa ukuhla kwe-heat conduction performance. Igrisi ye-Thermal igcwalisa ezi zikhewu zincinci, inciphisa ubukho bomoya kunye nokuphucula ukusebenza kakuhle kokuhambisa ubushushu.
2. Ukukhuthaza ukuqhutyelwa kobushushu: Igrisi ye-Thermal ine-conductivity egqwesileyo ye-thermal, enceda ukukhawulezisa ukuqhutyelwa kobushushu obuveliswa yi-CPU kwi-heat sink kunye nokugcina ubushushu be-CPU buzinzile.
3. Khusela i-CPU: Igrisi ye-Thermal inokunciphisa ingxabano phakathi kwe-CPU kunye ne-heatsink, ukuphepha ukuguga kunye nokukrazula, kunye nokwandisa ubomi be-CPU kunye ne-heatsink.
Xa uhlanganisa i-CPU epholileyo, ukusebenzisa umlinganiselo ochanekileyo wegrisi ye-CPU eshushu kunokunceda ukufezekisa ukutshatyalaliswa kobushushu kunye nokunqanda imiba yokusebenza kunye nomonakalo obangelwa kukushisa kwe-CPU. Ngoko ke, kubalulekile ukukhetha igrisi ephezulu yokushisa kwaye uyisebenzise ngokuchanekileyo kumphezulu we-CPU ukuqinisekisa ukuba i-CPU isebenza kwiqondo lokushisa eliphantsi elizinzileyo.