I-LGA 1700 CPU BCF

I-Jungle Leopard Intel 12th Gen 13th Gen CPU Buckle BCF LGA1700/1800 Motherboard Pressure Plate, Ibhande Elingagoqeki, Ibhande Elilungisiwe Elilungisiwe, Ubakaki Ongaguquki, Ipuleti Eliphikisayo

“Ifakwe amathuluzi okufaka

Zonke i-aluminium

Ukuvulwa kwesikhunta sendawo yembobo enembile"

Xhumana nathi

imininingwane yomkhiqizo

ethula

Lesi sibophelelo esinqanda ukugoba senziwe ngayo yonke into eyinhlanganisela ye-aluminium futhi sihambisana nesibophelelo esikhethekile se-LGA 1700 esiyisipesheli sokugoba ukuze kuxazululwe inkinga yekhava ephezulu ye-CPU nokuguqulwa kwe-PCB. Igwema amandla ku-motherboard futhi isebenzisa izinyawo zokuvikela zangempela.

Ishalofu lokugoba lebhodi lomama le-CPU elingu-1700 liyisisetshenziswa esisetshenziselwa ukusekela nokuvikela ama-CPU amakhulu, asindayo afakwe kuma-motherboard. Uma i-CPU efakiwe inkulu kakhulu noma isindayo, ingabangela ukucindezelwa okuthile noma ukuchezukela ebhodini lomama, okuzophazamisa ukusebenza nokuzinza kwebhodi lomama, futhi kubangele nokuhluleka kwehadiwe.

Amashalofu amelene nokugoba ebhodi lomama aklanyelwe ukunikeza ukwesekwa okwengeziwe nokuzinza ebhodini lomama, anciphise ukucindezelwa kwe-CPU ebhodini lomama, avimbele ibhodi lomama ukuthi lingaguquguquki, futhi asize ukuvikela ibhodi lomama emonakalweni. Ngokuvamile kwenziwa ngezinto eziqinile zensimbi, ezingasekela ngempumelelo i-CPU futhi zithuthukise ukuzinza nokuqina kwesistimu.

Kubalulekile ukukhetha ishalofu lokugoba lebhodi lomama elifanele ifreyimu ethize ye-CPU kanye nosayizi webhodi lomama, ukuze uqinisekise ukuthi ingcindezi ekhiqizwa ngesikhathi sokufakwa nokusetshenziswa isatshalaliswa ngempumelelo, inwebe impilo yebhodi lomama ne-CPU, futhi ithuthukise ukusebenza nokuzinza kwalo lonke uhlelo.